Toshihisa Nonaka

According to our database, Toshihisa Nonaka authored at least 2 papers between 2016 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package.

Koji Hamaguchi, Mitsuki Nakata, Kouta Segawa, Naoya Suzuki, Toshihisa Nonaka

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection.

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou

Microelectron. Reliab., 2016