Toshihiro Itoh
Orcid: 0000-0001-9679-085X
According to our database1,
Toshihiro Itoh
authored at least 52 papers
between 1998 and 2024.
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Bibliography
2024
Wearable EMG Measurement Device Using Polyurethane Foam for Motion Artifact Suppression.
Sensors, May, 2024
A Wireless Passive Pressure-Sensing Method for Cryogenic Applications Using Magnetoresistors.
Sensors, February, 2024
IEEE Trans. Ind. Electron., 2024
2023
A Passive Sensing-Wireless Transmitting Scheme Demonstrated by Integrating a Magnetic Cantilever With a Microstrip Patch for DC Current Monitoring.
IEEE Trans. Instrum. Meas., 2023
Sensors, 2023
Fabrication of an E-Textile Bioelectrode Array With Screen-Printed Wiring and an Ionic Liquid Gel Toward Cutaneous Whole-Body Electromyography.
IEEE Access, 2023
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023
Stretchable Microscale Patterned Interconnects Formed on Micro-Corrugated Vertical Wavy Structured Substrate.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023
Development of a Robust Vision-Based Interstory Deformation Sensing Method Using a Kernelized Correlation Filter.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023
A Map Feature Fusion Based Artifact Removal Method for Non-Contact Vital Sign Detection with a Single FMCW Radar.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023
Estimation of Splitting Interval in Second Heart Sound by Optimizing a Demixing Vector.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023
2022
IEEE Trans. Instrum. Meas., 2022
A Passive Field Conversion-Amplification Scheme: Demonstrated by Integrating a Magnetic Cantilever With a TMR for Current Monitoring.
IEEE Trans. Ind. Electron., 2022
Urethane-Foam-Embedded Silicon Pressure Sensors including Stress-Concentration Packaging Structure for Driver Posture Monitoring.
Sensors, 2022
IEEE Access, 2022
Proceedings of the 2022 IEEE Sensors, Dallas, TX, USA, October 30 - Nov. 2, 2022, 2022
Proceedings of the 2022 IEEE Sensors, Dallas, TX, USA, October 30 - Nov. 2, 2022, 2022
2021
IEEE Trans. Ind. Electron., 2021
2020
Valve-Actuator-Integrated Reference Electrode for an Ultra-Long-Life Rumen pH Sensor.
Sensors, 2020
Silicon Photonics Coherent Optical Subassembly with EO and OE Bandwidths of over 50 GHz.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2020
2019
Growth Behavior of Au Films on SiO<sub>2</sub> Film and Direct Transfer for Smoothing Au Surfaces.
Int. J. Autom. Technol., 2019
Fabrication and Evaluation of MEMS Piezoelectric Vibration Sensor with Energy Harvesting Function.
Proceedings of the 14th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2019
Neural network estimation of eardrum temperature using six sensors integrated on a wristwatch-sized device.
Proceedings of the 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019, 2019
Electrolyte-Flow-Controlled Reference Electrode using Hydrogen Pressure for an Ultra-Long-Life Rumen pH Sensor.
Proceedings of the 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019, 2019
2018
Safety Technologies in Autonomous Decentralized Railway Control System and its Future Studies.
IEICE Trans. Commun., 2018
2017
Minimized Bolus-Type Wireless Sensor Node with a Built-In Three-Axis Acceleration Meter for Monitoring a Cow's Rumen Conditions.
Sensors, 2017
Proceedings of the 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2017
2016
An InP-Based 27-GHz-Bandwidth Limiting TIA IC Designed to Suppress Undershoot and Ringing in Its Output Waveform.
IEICE Trans. Electron., 2016
Printed carbon-based sensors array for measuring 2D dynamic strain distribution and application in structural health monitoring.
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
Ultra-thin piezoelectric strain sensor array integrated on flexible printed circuit for structural health monitoring.
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
Wireless vibration sensing system powered by a piezoelectric MEMS vibration energy harvester.
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
2015
IEICE Electron. Express, 2015
2013
Development of a Wireless Sensor for the Measurement of Chicken Blood Flow Using the Laser Doppler Blood Flow Meter Technique.
IEEE Trans. Biomed. Eng., 2013
Battery-less wireless current sensor node utilizing the dependence of charging time of a capacitor on the current flowing through a power line.
IEICE Electron. Express, 2013
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013
Proceedings of the 2013 IEEE Eighth International Conference on Intelligent Sensors, 2013
2012
Fabrication of conductive polymer coated elastomer contact structures using a reel-to-reel continuous fiber process.
IEICE Electron. Express, 2012
Characterization of super-harmonic effect using piezoelectric film cantilever with a proof mass in the point.
Proceedings of the 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2012
2011
Effects of Preamplifier Nonlinearity on PMD Equalization with Electronic Dispersion Compensation for 43G DQPSK.
IEICE Trans. Electron., 2011
Development of a MEMS DC electric current sensor applicable to two-wire electrical appliance cord.
Proceedings of the 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2011
2010
Study of a PMD Tolerance Extension by InP HBT Analog EDC IC without Adaptive Control in 43G DQPSK Transmission.
IEICE Trans. Electron., 2010
2008
High Quality Factor Silicon Cantilever Driven by PZT Actuator for Resonant Based Mass Detection
CoRR, 2008
2005
Computational dynamics method for evaluating the mobility of charged biomolecules passing through the electrical potential field within the ion selective channel on an excitable membrane.
Artif. Life Robotics, 2005
2003
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method.
Microelectron. Reliab., 2003
Proceedings of the Proceedings 2003 International Test Conference (ITC 2003), Breaking Test Interface Bottlenecks, 28 September, 2003
2002
Proceedings of the Proceedings IEEE International Test Conference 2002, 2002
1999
Proceedings of the 9th Great Lakes Symposium on VLSI (GLS-VLSI '99), 1999
Proceedings of the 9th Great Lakes Symposium on VLSI (GLS-VLSI '99), 1999
1998
Proceedings of the 28th IEEE International Symposium on Multiple-Valued Logic, 1998