Toshihiko Ochiai

According to our database, Toshihiko Ochiai authored at least 2 papers in 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Testability improvement for 12.8 GB/s Wide IO DRAM controller by small area pre-bonding TSV tests and a 1 GHz sampled fully digital noise monitor.

Takao Nomura, Ryo Mori, Munehiro Ito, Koji Takayanagi, Toshihiko Ochiai, Kazuki Fukuoka, Kazuo Otsuga, Koji Nii, Sadayuki Morita, Tomoaki Hashimoto, Tsuyoshi Kida, Junichi Yamada, Hideki Tanaka

Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013

High density and reliable packaging technology with Non Conductive Film for 3D/TSV.

Kentaro Mori, Yoshihiro Ono, Shinji Watanabe, Toshikazu Ishikawa, Michiaki Sugiyama, Satoshi Imasu, Toshihiko Ochiai, Ryo Mori, Tsuyoshi Kida, Tomoaki Hashimoto, Hideki Tanaka, Michitaka Kimura

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013