Tong Xing
Orcid: 0000-0003-2099-6418
According to our database1,
Tong Xing
authored at least 16 papers
between 2020 and 2024.
Collaborative distances:
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Bibliography
2024
Characteristic Study of a Valve-Matched Flow Single-Piston Miniature Water-Hydraulic Pump.
IEEE Access, 2024
Electrical Behaviors During Rise and Fall of Pantograph of Electric Locomotive in Traction Power Supply System.
IEEE Access, 2024
Electrical Characterization of Pantograph and Catenary Offline Under Train Operating Conditions Based on Improved Habedank Model and AT Power Supply Network.
IEEE Access, 2024
Proceedings of the 25th International Middleware Conference, 2024
Proceedings of the 2nd ACM SIGSPATIAL International Workshop on Human Mobility Prediction Challenge, 2024
2023
Aggregate VM: Why Reduce or Evict VM's Resources When You Can Borrow Them From Other Nodes?
Dataset, March, 2023
Measurement and Analysis of Electrical Behaviors of Offline Discharge Between High-Speed Contact Wire and Pantograph of Locomotive.
IEEE Trans. Instrum. Meas., 2023
Research on the Output Characteristic of a New Water Hydraulic Electrohydraulic Motor.
IEEE Access, 2023
Aggregate VM: Why Reduce or Evict VM's Resources When You Can Borrow Them From Other Nodes?
Proceedings of the Eighteenth European Conference on Computer Systems, 2023
Proceedings of the 2023 ACM Symposium on Cloud Computing, SoCC 2023, 2023
2022
Multi-Scale Progressive Fusion Attention Network Based on Small Sample Training for DAS Noise Suppression.
IEEE Trans. Geosci. Remote. Sens., 2022
The neutral layer offset of medium and thick plate by sub domain boundary element method during plate flattening.
Adv. Eng. Softw., 2022
Boundary element method with particle swarm optimization for solving potential problems.
Adv. Eng. Softw., 2022
Proceedings of the APSys '22: 13th ACM SIGOPS Asia-Pacific Workshop on Systems, Virtual Event, Singapore, August 23, 2022
2021
ACM Trans. Comput. Syst., 2021
2020
Proceedings of the VEE '20: 16th ACM SIGPLAN/SIGOPS International Conference on Virtual Execution Environments, 2020