Tong Hong Wang

According to our database, Tong Hong Wang authored at least 8 papers between 2005 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2013

Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile.

Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai

Microelectron. Reliab., 2013

2012

Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.

Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang

Microelectron. Reliab., 2012

2011

Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA.

Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai

Microelectron. Reliab., 2011

2008

Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions.

Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin

Microelectron. Reliab., 2008

Structural characteristics of carbon nanostructures synthesized by ECR-CVD.

Te-Hua Fang, Tong Hong Wang, Deng-Maw Lu, Wen-Chieh Lien

Microelectron. J., 2008

2007

Cyclic bending reliability of wafer-level chip-scale packages.

Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen

Microelectron. Reliab., 2007

Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages.

Yi-Shao Lai, Tong Hong Wang

Microelectron. Reliab., 2007

2005

Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly.

Yi-Shao Lai, Tong Hong Wang

Microelectron. Reliab., 2005