Tomi Laurila
Orcid: 0000-0002-1252-8764
According to our database1,
Tomi Laurila
authored at least 6 papers
between 2005 and 2020.
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Bibliography
2020
2019
Proceedings of the 62nd IEEE International Midwest Symposium on Circuits and Systems, 2019
2013
Proceedings of the 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2013
2009
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers.
Microelectron. Reliab., 2009
2007
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests.
Microelectron. Reliab., 2007
2005
Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate.
Microelectron. Reliab., 2005