Tomasz Raszkowski

Affiliations:
  • Lodz University of Technology, Poland


According to our database1, Tomasz Raszkowski authored at least 12 papers between 2015 and 2018.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2018
Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs.
Microelectron. Reliab., 2018

Influence of temperature and heat flux time lags on the temperature distribution in modern GAAFET structure based on Dual-Phase-Lag thermal model.
Microelectron. Reliab., 2018

Experimental identification of LED compact thermal model element values.
Microelectron. Reliab., 2018

Determining Parameters of the Dual-Phase-Lag Model of Heat Flow.
Proceedings of the 25th International Conference "Mixed Design of Integrated Circuits and System", 2018

2017
Experimental investigation of discrete air cooled device thermal resistance dependence on cooling conditions.
Microelectron. Reliab., 2017

The Numerical Approaches to Heat Transfer Problem in Modern Electronic Structures.
Comput. Sci., 2017

Comparative analysis of compact thermal models generated from measured thermal responses and detailed thermal models.
Proceedings of the 24th International Conference Mixed Design of Integrated Circuits and Systems, 2017

2016
The distributed thermal model of fin field effect transistor.
Microelectron. Reliab., 2016

Modelling of average radiation and convection heat transfer coefficient value in electronic systems.
Proceedings of the 2016 MIXDES, 2016

Thermal simulation of nanoscale platinium heaters.
Proceedings of the 2016 MIXDES, 2016

2015
Comparison of Green's function solutions for different heat conduction models in electronic nanostructures.
Microelectron. J., 2015

Numerical solution of 1-D DPL heat transfer equation.
Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015


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