Tomasz Bieniek

According to our database1, Tomasz Bieniek authored at least 9 papers between 2008 and 2016.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2016
New approach for a multi-cantilever arrays sensor system with advanced MOEMS readout.
Proceedings of the 46th European Solid-State Device Research Conference, 2016

2014
Investigation on reliability of interconnects in 3D heterogeneous systems by ageing beam resonance method.
Microelectron. J., 2014

Innovative SiC over Si photodiode based dual-band, 3D integrated detector.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Novel methodology for 3D MEMS-IC design and co-simulation on MEMS microphone smart system example.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013
Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011
Determination of electrical and mechanical parameters in capacitive MEMS accelerometers using electrical measurements.
Microelectron. Reliab., 2011

2009
Reliability aspects of 3D-oriented heterogeneous device design related to stress sensitivity of MOS transistors.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

2008
Reliability issues of e-Cubes heterogeneous system integration.
Microelectron. Reliab., 2008

The HDL and FE Thermal Modeling of Heterogeneous Systems.
Proceedings of the 11th IEEE Workshop on Design & Diagnostics of Electronic Circuits & Systems (DDECS 2008), 2008


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