Tom J. Smy

Orcid: 0000-0001-5369-0082

According to our database1, Tom J. Smy authored at least 18 papers between 1991 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2024
Time-Domain Analysis of Temporally and Spatially Dispersive Metasurfaces in GSTC-FDTD Frameworks.
IEEE Access, 2024

2023
Implementation of Traveling Wave Models of Grating-Based Integrated Optical Devices for Circuit Simulation.
IEEE Access, 2023

2022
Circular Optical Phased Array with Large Steering Range and High Resolution.
Sensors, 2022

Metasurface Near-Field Measurements with Incident Field Reconstruction Using a Single Horn Antenna.
IEEE Instrum. Meas. Mag., 2022

2021
Obtaining an Operating Point Solution of a Traveling Wave Laser Model.
IEEE Access, 2021

2020
Integration of Traveling Wave Optical Device Models Into an MNA-Based Circuit Simulator.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020

FDTD Simulation of Dispersive Metasurfaces With Lorentzian Surface Susceptibilities.
IEEE Access, 2020

Surface Susceptibility Synthesis of Metasurface Holograms for Creating Electromagnetic Illusions.
IEEE Access, 2020

Surface Susceptibility Synthesis of Metasurface Skins/Holograms for Electromagnetic Camouflage/Illusions.
IEEE Access, 2020

2013
Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013

2012
Robust Simulation of Opto-Electronic Systems by Alternating Complex Envelope Representations.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012

2004
Compact, netlist-based representation of thermal transient coupling using controlled sources.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2004

2003
A simplified model for the effect of interfinger metal on maximum temperature rise in a multifinger bipolar transistor.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2003

Modeling facet heating in ridge lasers.
Microelectron. Reliab., 2003

2002
Equivalent circuit modeling of static substrate thermal coupling using VCVS representation.
IEEE J. Solid State Circuits, 2002

2001
A 3D thermal simulation tool for integrated devices-Atar.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2001

A completely integrated 2 GHz VCO with post-processed Cu inductors.
Proceedings of the IEEE 2001 Custom Integrated Circuits Conference, 2001

1991
Ballistic deposition simulation of via metallization using a quasi-three-dimensional model.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1991


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