Tobias Grözinger

According to our database, Tobias Grözinger authored at least 6 papers between 2017 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane.

Adrian Schwenck, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, André Zimmermann

Sensors, 2021

2019

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation.

Mahdi Soltani, Romit Kulkarni, Tobias Scheinost, Tobias Groezinger, André Zimmermann

IEEE Access, 2019

2018

Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation.

Paul Wild, Dominik Lorenz, Tobias Grözinger, André Zimmermann

Microelectron. Reliab., 2018

Effect of Joule heating on the reliability of solder joints under power cycling conditions.

Jie Mei, R. Haug, O. Lanier, Tobias Grözinger, André Zimmermann

Microelectron. Reliab., 2018

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB.

Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, André Zimmermann

IEEE Access, 2018

2017

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates.

Paul Wild, Tobias Grözinger, Dominik Lorenz, André Zimmermann

IEEE Trans. Reliab., 2017