TJ Dai

According to our database, TJ Dai authored at least 2 papers in 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and On-Chip ISP and ESP Function.

Menghan Guo, Shoushun Chen, Zhe Gao, Wenlei Yang, Peter Bartkovjak, Qing Qin, Xiaoqin Hu, Dahai Zhou, Qiping Huang, Masayuki Uchiyama, Yoshiharu Kudo, Shimpei Fukuoka, Chengcheng Xu, Hiroaki Ebihara, Xueqing Wang, Peiwen Jiang, Bo Jiang, Bo Mu, Huan Chen, Jason Yang, TJ Dai, Andreas Suess

IEEE J. Solid State Circuits, November, 2023

A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1 MPixel EVS with 4.6GEvent/s Readout, In-Pixel TDC and On-Chip ISP and ESP Function.

Menghan Guo, Shoushun Chen, Zhe Gao, Wenlei Yang, Peter Bartkovjak, Qing Qin, Xiaoqin Hu, Dahei Zhou, Masayuki Uchiyama, Shimpei Fukuoka, Chengcheng Xu, Hiroaki Ebihara, Andy Wang, Peiwen Jiang, Bo Jiang, Bo Mu, Huan Chen, Jason Yang, TJ Dai, Andreas Suess, Yoshiharu Kudo

Proceedings of the IEEE International Solid- State Circuits Conference, 2023