Tingting Leng
According to our database1,
Tingting Leng
authored at least 5 papers
between 2022 and 2024.
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Bibliography
2024
Scheduling of Single-Arm Cluster Tools Handling Multiple Wafer Types Based on Double-Layer Configuration of Processing Modules.
IEEE Trans Autom. Sci. Eng., October, 2024
2023
Proceedings of the ECAI 2023 - 26th European Conference on Artificial Intelligence, September 30 - October 4, 2023, Kraków, Poland, 2023
Optimal Cyclic Scheduling of Wafer-Residency-Time-Constrained Dual-Arm Cluster Tools by Configuring Processing Modules and Adjusting Robot Waiting Time.
Proceedings of the 19th IEEE International Conference on Automation Science and Engineering, 2023
2022
Digit. Signal Process., 2022
Proceedings of the IEEE International Conference on Networking, Sensing and Control, 2022