Ting Chia Chang

Orcid: 0000-0002-2571-2018

Affiliations:
  • Stanford University, Stanford, CA, USA


According to our database1, Ting Chia Chang authored at least 11 papers between 2014 and 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Bibliography

2019
Multi-Access Networking with Wireless Ultrasound-Powered Implants.
Proceedings of the 2019 IEEE Biomedical Circuits and Systems Conference, 2019

2018
A mm-Sized Wireless Implantable Device for Electrical Stimulation of Peripheral Nerves.
IEEE Trans. Biomed. Circuits Syst., 2018

End-to-End Design of Efficient Ultrasonic Power Links for Scaling Towards Submillimeter Implantable Receivers.
IEEE Trans. Biomed. Circuits Syst., 2018

A Miniaturized Single-Transducer Implantable Pressure Sensor With Time-Multiplexed Ultrasonic Data and Power Links.
IEEE J. Solid State Circuits, 2018

Long-term in vivo performance of novel ultrasound powered implantable devices.
Proceedings of the 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2018

Wireless data links for next-generation networked micro-implantables.
Proceedings of the 2018 IEEE Custom Integrated Circuits Conference, 2018

2017
27.7 A 30.5mm<sup>3</sup> fully packaged implantable device with duplex ultrasonic data and power links achieving 95kb/s with <10<sup>-4</sup> BER at 8.5cm depth.
Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

Scaling of ultrasound-powered receivers for sub-millimeter wireless implants.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2017

2016
An ultrasonically powered implantable device for targeted drug delivery.
Proceedings of the 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2016

2015
A mm-Sized Implantable Medical Device (IMD) With Ultrasonic Power Transfer and a Hybrid Bi-Directional Data Link.
IEEE J. Solid State Circuits, 2015

2014
A mm-sized implantable device with ultrasonic energy transfer and RF data uplink for high-power applications.
Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, 2014


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