Timwah Luk

According to our database, Timwah Luk authored at least 2 papers between 2005 and 2008.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2008

3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package.

Yong Liu, Lihua Liang, Scott Irving, Timwah Luk

Microelectron. Reliab., 2008

2005

Modeling MOS Snapback for Circuit-Level ESD Simulation Using BSIM3 and VBIC Models.

Yuanzhong Paul Zhou, Duane Connerney, Ronald Carroll, Timwah Luk

Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005