Timothy McMullen

According to our database, Timothy McMullen authored at least 2 papers in 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Constant voltage electromigration for advanced BEOL copper interconnects.

Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress.

D. Slottke, R. J. Kamaladasa, M. Harmes, Ilan Tsameret, Mauro J. Kobrinsky, Timothy McMullen, John Dunklee

Proceedings of the IEEE International Reliability Physics Symposium, 2015