Tim T. Hoang

According to our database1, Tim T. Hoang authored at least 8 papers between 2020 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2024
Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration.
IEEE J. Solid State Circuits, April, 2024

Automated Tuning of Ring-Assisted MZI-Based Interleaver for DWDM Systems.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2024

2023
Arvon: A Heterogeneous SiP Integrating a 14nm FPGA and Two 22nm 1.8TFLOPS/W DSPs with 1.7Tbps/mm<sup>2</sup> AIB 2.0 Interface to Provide Versatile Workload Acceleration.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Simultaneous Error-Free Data Modulation with Silicon Microdisks in the Multi-FSR Regime for Scalable DWDM Links.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

2022

2021

2020
TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O.
IEEE Micro, 2020


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