Tim Englert
Orcid: 0000-0001-8622-917X
According to our database1,
Tim Englert
authored at least 3 papers
between 2021 and 2024.
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Bibliography
2024
Rapid Detection of Cleanliness on Direct Bonded Copper Substrate by Using UV Hyperspectral Imaging.
Sensors, July, 2024
2021
UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper.
Sensors, 2021
Use of Hyperspectral Imaging for the Quantification of Organic Contaminants on Copper Surfaces for Electronic Applications.
Sensors, 2021