Tianshuo Bai
Orcid: 0000-0002-3966-1442
According to our database1,
Tianshuo Bai
authored at least 3 papers
between 2023 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
2023
2024
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Bibliography
2024
An End-to-End In-Memory Computing System Based on a 40-nm eFlash-Based IMC SoC: Circuits, Toolchains, and Systems Co-Design Framework.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2024
2023
IEEE Trans. Emerg. Top. Comput., 2023
A 40nm 5-16Tops/W@INT8 eFlash In-Memory Computing SoC Chip with Noise Suppression and Compensation Techniques to Improve the Accuracy.
Proceedings of the IEEE International Conference on Integrated Circuits, 2023