Tianshuo Bai

According to our database, Tianshuo Bai authored at least 3 papers between 2023 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

An End-to-End In-Memory Computing System Based on a 40-nm eFlash-Based IMC SoC: Circuits, Toolchains, and Systems Co-Design Framework.

Tianshuo Bai, Wanru Mao, Guangyao Wang, Hanjie Liu, Aifei Zhang, Shihang Fu, Shuaikai Liu, Jianchao Hu, Xitong Yang, Biao Pan, Wei W. Xing, Wang Kang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2024

2023

A Survey of MRAM-Centric Computing: From Near Memory to In Memory.

Yueting Li, Tianshuo Bai, Xinyi Xu, Yundong Zhang, Bi Wu, Hao Cai, Biao Pan, Weisheng Zhao

IEEE Trans. Emerg. Top. Comput., 2023

A 40nm 5-16Tops/W@INT8 eFlash In-Memory Computing SoC Chip with Noise Suppression and Compensation Techniques to Improve the Accuracy.

Guanavao Wang, Yuexi Lv, Yu Tian, Jian Zhang, Carol Guo, Tianshuo Bai, Biao Pan, Derek Wang, Wang Kang

Proceedings of the IEEE International Conference on Integrated Circuits, 2023