Thorbjorn Ebefors

According to our database, Thorbjorn Ebefors authored at least 3 papers between 2013 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires.

Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf E. Martensson, Mikhail Asiatici, Andreas C. Fischer, Göran Stemme, Thorbjorn Ebefors, Frank Niklaus

IEEE Access, 2018

2015

High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications.

P. J. de Veen, C. Bos, D. R. Hoogstede, C. Th. A. Revenberg, Jessica Liljeholm, Thorbjorn Ebefors

Microelectron. Reliab., 2015

2013

The development and evaluation of RF TSV for 3D IPD applications.

Thorbjorn Ebefors, Jessica Fredlund, Daniel Perttu, Raymond van Dijk, Lorenzo Cifola, Mikko Kaunisto, Pekka Rantakari, Tauno Vaha-Heikkila

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013