Thomas Vervust
Orcid: 0000-0003-2771-3679
According to our database1,
Thomas Vervust
authored at least 8 papers
between 2013 and 2021.
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Collaborative distances:
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Bibliography
2021
Fully Integrated Flexible Dielectric Monitoring Sensor System for Real-Time In Situ Prediction of the Degree of Cure and Glass Transition Temperature of an Epoxy Resin.
IEEE Trans. Instrum. Meas., 2021
Correction to: The Augmented Movement Platform For Embodied Learning (AMPEL): development and reliability.
J. Multimodal User Interfaces, 2021
The Augmented Movement Platform For Embodied Learning (AMPEL): development and reliability.
J. Multimodal User Interfaces, 2021
2019
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019
2016
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
2015
Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability.
Microelectron. Reliab., 2015
2014
Proceedings of the Fifth International Workshop on Mobile Cloud Computing & Services, 2014
2013
Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor.
Microelectron. Reliab., 2013