Thomas Signamarcheix

According to our database1, Thomas Signamarcheix authored at least 9 papers between 2009 and 2021.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2021
Overcoming the Data Deluge Challenges with Greener Electronics.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021

2014
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO<sub>2</sub> direct hybrid bonding.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013
Novel low temperature 3D wafer stacking technology for high density device integration.
Proceedings of the European Solid-State Device Research Conference, 2013

Chip to wafer copper direct bonding electrical characterization and thermal cycling.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012
Deep-amorphization and solid-phase epitaxial regrowth processes for hybrid orientation technologies in SOI MOSFETs with thin body.
Microelectron. Reliab., 2012

2011
200°C direct bonding copper interconnects : Electrical results and reliability.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009
First integration of Cu TSV using die-to-wafer direct bonding and planarization.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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