Thomas Signamarcheix

According to our database, Thomas Signamarcheix authored at least 9 papers between 2009 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

Overcoming the Data Deluge Challenges with Greener Electronics.

Jean-René Léquepeys, Marc Duranton, Susana Bonnetier, Sandrine Catrou, Richard Fournel, Thomas Ernst, Laurent Hérault, D. Louis, A. Jerraya, Alexandre Valentian, François Perruchot, Thomas Signamarcheix, Elisa Vianello, Carlo Reita

Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021

2014

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO₂ direct hybrid bonding.

Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Novel low temperature 3D wafer stacking technology for high density device integration.

Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu

Proceedings of the European Solid-State Device Research Conference, 2013

Chip to wafer copper direct bonding electrical characterization and thermal cycling.

Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Deep-amorphization and solid-phase epitaxial regrowth processes for hybrid orientation technologies in SOI MOSFETs with thin body.

Akiko Ohata, Young-Ho Bae, Sorin Cristoloveanu, Thomas Signamarcheix, J. Widiez, Bruno Ghyselen, Olivier Faynot, Laurent Clavelier

Microelectron. Reliab., 2012

2011

200°C direct bonding copper interconnects : Electrical results and reliability.

Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.

Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

First integration of Cu TSV using die-to-wafer direct bonding and planarization.

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier

Proceedings of the IEEE International Conference on 3D System Integration, 2009