Thomas E. Sarvey

According to our database, Thomas E. Sarvey authored at least 4 papers between 2014 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2016

The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study.

William Wahby, Thomas E. Sarvey, Hardik Sharma, Hadi Esmaeilzadeh, Muhannad S. Bakir

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Embedded cooling technologies for densely integrated electronic systems.

Thomas E. Sarvey, Yang Zhang, Li Zheng, Paragkumar Thadesar, Ravi Gutala, Colman Cheung, Arifur Rahman, Muhannad S. Bakir

Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015

2014

Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects.

Chaoqi Zhang, Paragkumar Thadesar, Muneeb Zia, Thomas E. Sarvey, Muhannad S. Bakir

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation.

Yang Zhang, Thomas E. Sarvey, Muhannad S. Bakir

Proceedings of the 2014 International 3D Systems Integration Conference, 2014