Thibaut Heckmann

According to our database, Thibaut Heckmann authored at least 13 papers between 2016 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2024

Case of study for in situ memory reading on damaged MultiMedia Card.

Fabien Thomas-Brans, Aya Fukami, Q. Clement, Thibaut Heckmann, Damien Sauveron

Forensic Sci. Int. Digit. Investig., 2024

2022

A forensic analysis of the Google Home: repairing compressed data without error correction.

Hadrien Barral, Georges-Axel Jaloyan, Fabien Thomas-Brans, Matthieu Regnery, Rémi Géraud-Stewart, Thibaut Heckmann, Thomas R. Souvignet, David Naccache

Digit. Investig., 2022

New Diagnostic Forensic Protocol for Damaged Secure Digital Memory Cards.

Fabien Thomas-Brans, Thibaut Heckmann, Konstantinos Markantonakis, Damien Sauveron

IEEE Access, 2022

2021

Medical Equipment Used for Forensic Data Extraction: A low-cost solution for forensic laboratories not provided with expensive diagnostic or advanced repair equipment.

Thibaut Heckmann, Thomas R. Souvignet, Damien Sauveron, David Naccache

Digit. Investig., 2021

Physical Fault Injection and Side-Channel Attacks on Mobile Devices: A Comprehensive Survey.

Carlton Shepherd, Konstantinos Markantonakis, Nico van Heijningen, Driss Aboulkassimi, Clément Gaine, Thibaut Heckmann, David Naccache

CoRR, 2021

Physical fault injection and side-channel attacks on mobile devices: A comprehensive analysis.

Carlton Shepherd, Konstantinos Markantonakis, Nico van Heijningen, Driss Aboulkassimi, Clément Gaine, Thibaut Heckmann, David Naccache

Comput. Secur., 2021

2020

From Lucky Luke to Lock Bits.

Thomas R. Souvignet, Thibaut Heckmann, Timothy Bollé

IEEE Secur. Priv., 2020

2019

Decrease of energy deposited during laser decapsulation attacks by dyeing and pigmenting the ECA: Application to the forensic micro-repair of wire bonding.

Thibaut Heckmann, Thomas R. Souvignet, David Naccache

Digit. Investig., 2019

Removing epoxy underfill between neighbouring components using acid for component chip-off.

Thibaut Heckmann, James P. McEvoy, Konstantinos Markantonakis, Raja Naeem Akram, David Naccache

Digit. Investig., 2019

2018

Reverse engineering secure systems using physical attacks. (Rétro-conception de systèmes sécurisés par attaques physiques).

Thibaut Heckmann

PhD thesis, 2018

Forensic smartphone analysis using adhesives: Transplantation of Package on Package components.

Thibaut Heckmann, Konstantinos Markantonakis, David Naccache, Thomas R. Souvignet

Digit. Investig., 2018

2017

Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics.

Thibaut Heckmann, Thomas R. Souvignet, David Naccache

Digit. Investig., 2017

2016

Low-temperature low-cost 58 Bismuth - 42 Tin alloy forensic chip re-balling and re-soldering.

Thibaut Heckmann, Thomas R. Souvignet, S. Lepeer, David Naccache

Digit. Investig., 2016