Thibaut Heckmann

Orcid: 0000-0002-0646-0038

According to our database1, Thibaut Heckmann authored at least 13 papers between 2016 and 2024.

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Bibliography

2024
Case of study for in situ memory reading on damaged MultiMedia Card.
Forensic Sci. Int. Digit. Investig., 2024

2022
A forensic analysis of the Google Home: repairing compressed data without error correction.
Digit. Investig., 2022

New Diagnostic Forensic Protocol for Damaged Secure Digital Memory Cards.
IEEE Access, 2022

2021
Medical Equipment Used for Forensic Data Extraction: A low-cost solution for forensic laboratories not provided with expensive diagnostic or advanced repair equipment.
Digit. Investig., 2021

Physical Fault Injection and Side-Channel Attacks on Mobile Devices: A Comprehensive Survey.
CoRR, 2021

Physical fault injection and side-channel attacks on mobile devices: A comprehensive analysis.
Comput. Secur., 2021

2020
From Lucky Luke to Lock Bits.
IEEE Secur. Priv., 2020

2019
Decrease of energy deposited during laser decapsulation attacks by dyeing and pigmenting the ECA: Application to the forensic micro-repair of wire bonding.
Digit. Investig., 2019

Removing epoxy underfill between neighbouring components using acid for component chip-off.
Digit. Investig., 2019

2018
Reverse engineering secure systems using physical attacks. (Rétro-conception de systèmes sécurisés par attaques physiques).
PhD thesis, 2018

Forensic smartphone analysis using adhesives: Transplantation of Package on Package components.
Digit. Investig., 2018

2017
Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics.
Digit. Investig., 2017

2016
Low-temperature low-cost 58 Bismuth - 42 Tin alloy forensic chip re-balling and re-soldering.
Digit. Investig., 2016


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