Thibault Buisson

According to our database, Thibault Buisson authored at least 4 papers between 2010 and 2012.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.

Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011

3D stacking using ultra thin dies.

Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, Wenqi Zhang, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.

Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.

Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen

Proceedings of the IEEE International Conference on 3D System Integration, 2010