Teu-Hua Lin

According to our database, Teu-Hua Lin authored at least 1 paper in 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Low temperature (<180 °C) bonding for 3D integration.

Yan-Pin Huang, Ruoh-Ning Tzeng, Yu-San Chien, Ming-Shaw Shy, Teu-Hua Lin, Kuo-Hua Chen, Ching-Te Chuang, Wei Hwang, Chi-Tsung Chiu, Ho-Ming Tong, Kuan-Neng Chen

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013