Tei-Chen Chen

According to our database, Tei-Chen Chen authored at least 4 papers between 2003 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes.

Chin-Li Kao, Tei-Chen Chen

Microelectron. Reliab., 2018

2015

Thermal resistance of side by side multi-chip package: Thermal mode analysis.

Dao-Long Chen, Tei-Chen Chen, Ping-Feng Yang, Yi-Shao Lai

Microelectron. Reliab., 2015

2014

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages.

Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu

Microelectron. Reliab., 2014

2003

An inverse problem for a layered elastic plate.

Vladimir G. Romanov, Cheng-I Weng, Tei-Chen Chen

Appl. Math. Comput., 2003