Ted R. Lundquist

According to our database, Ted R. Lundquist authored at least 18 papers between 2001 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2016

Two-photon laser-assisted device alteration in CMOS integrated circuits using linearly, circularly and radially polarized light.

Marius Rutkauskas, Carl Farrell, Christophe Dorrer, Kara L. Marshall, Tom Crawford, Ted R. Lundquist, P. Vedagarbha, K. Erington, D. Bodoh, Derryck Telford Reid

Microelectron. Reliab., 2016

2015

Time-integrated photon emission as a function of temperature in 32 nm CMOS.

Andrea Bahgat Shehata, Alan J. Weger, Franco Stellari, Peilin Song, Hervé Deslandes, Ted R. Lundquist, Euan Ramsay

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014

Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials - An adaptive calibration algorithm.

Philipp Scholz, Norbert Herfurth, Michael Sadowski, Ted R. Lundquist, Uwe Kerst, Christian Boit

Microelectron. Reliab., 2014

2011

Foundry workflow for dynamic-EFA-based yield ramp.

Cathy Kardach, I. Kapilevich, Jeffrey A. Block, Ted R. Lundquist, Steven Kasapi, J. Liao, Yin S. Ng, Bruce Cory

Microelectron. Reliab., 2011

2010

Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments.

Philipp Scholz, Christian Gallrapp, Uwe Kerst, Ted R. Lundquist, Christian Boit

Microelectron. Reliab., 2010

Dynamic lock-in thermography for operation mode-dependent thermally active fault localization.

Rudolf Schlangen, Hervé Deslandes, Ted R. Lundquist, C. Schmidt, Frank Altmann, K. Yu, A. Andreasyan, S. Li

Microelectron. Reliab., 2010

2009

Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing.

Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Ted R. Lundquist, Peter Egger, Christian Boit

Microelectron. Reliab., 2009

Jitter analysis of PLL-generated clock propagation using Jitter Mitigation techniques with laser voltage probing.

Joy Y. Liao, Tung Ton, Nathan Slattengren, Steven Kasapi, William K. Lo, Howard L. Marks, Yin S. Ng, Ted R. Lundquist

Microelectron. Reliab., 2009

2008

Physical Techniques for Chip-Backside IC Debug in Nanotechnologies.

Christian Boit, Rudolf Schlangen, Uwe Kerst, Ted R. Lundquist

IEEE Des. Test Comput., 2008

2007

Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy.

Rudolf Schlangen, Uwe Kerst, Christian Boit, Tahir Malik, Rajesh Jain, Ted R. Lundquist

Microelectron. Reliab., 2007

Backside E-Beam Probing on Nano scale devices.

Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Christian Boit, Rajesh Jain, Tahir Malik, Keneth R. Wilsher, Ted R. Lundquist, Bernd Krüger

Proceedings of the 2007 IEEE International Test Conference, 2007

2005

Impact of back side circuit edit on active device performance in bulk silicon ICs.

Uwe Kerst, Rudolf Schlangen, A. Kabakow, Erwan Le Roy, Ted R. Lundquist, Siegfried Pauthner

Proceedings of the Proceedings 2005 IEEE International Test Conference, 2005

2003

Limitations to photon-emission microscopy when applied to "hot" devices.

Hervé Deslandes, Ted R. Lundquist

Microelectron. Reliab., 2003

Fault Localization using Time Resolved Photon Emission and STIL Waveforms.

Romain Desplats, Felix Beaudoin, Philippe Perdu, Nagamani Nataraj, Ted R. Lundquist, Ketan Shah

Proceedings of the Proceedings 2003 International Test Conference (ITC 2003), Breaking Test Interface Bottlenecks, 28 September, 2003

2002

Imaging and Material Analysis from Sputter-Induced Light Emission Using Coaxial Ion-Photon Column.

Chun-Cheng Tsao, Bill Thompson, Ted R. Lundquist

Microelectron. Reliab., 2002

Subresolution placement using IR image to CAD database alignment: an algorithm for silicon-side probing.

Madhumita Sengupta, Lokesh Johri, Chun-Cheng Tsao, Mark Thompson, Ted R. Lundquist

Proceedings of the Image Processing: Algorithms and Systems, 2002

2001

Ultra-Thinning of C4 Integrated Circuits for Backside Analysis during First Silicon Debug.

Ted R. Lundquist, E. Delenia, J. Harroun, E. LeRoy, Chun-Cheng Tsao

Microelectron. Reliab., 2001

Practical, non-invasive optical probing for flip-chip devices.

G. Dajee, Norman Goldblatt, Ted R. Lundquist, Steven Kasapi, Keneth R. Wilsher

Proceedings of the Proceedings IEEE International Test Conference 2001, Baltimore, MD, USA, 30 October, 2001