Tanemasa Asano

According to our database, Tanemasa Asano authored at least 13 papers between 2005 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Improving Glucose Sensor Sensitivity with Dual Resonator Placement.

Ahmed A. Zakaria, Ahmed Allam, Tanemasa Asano, Adel B. Abdel-Rahman

Proceedings of the 67th IEEE International Midwest Symposium on Circuits and Systems, 2024

Sensitivity Difference in Glucose Sensors with Varying the Placement of Two Resonators.

Ahmed A. Zakaria, Ahmed Allam, Tanemasa Asano, Adel B. Abdel-Rahman

Proceedings of the 67th IEEE International Midwest Symposium on Circuits and Systems, 2024

2022

Wireless Power Transfer for Battery-less Implantable Medical Devices using Hook-shaped Defected Ground Structure Resonators.

Jean Maurice Mwizerwa, Ahmed Allam, Tanemasa Asano, Adel B. Abdel-Rahman

Proceedings of the 31st Wireless and Optical Communications Conference, 2022

2019

Formation of Low Resistance Contacts to p-type 4H-SiC using Al-Film Source Laser Doping.

Kento Okamoto, Toshifumi Kikuchi, Akihiro Ikeda, Hiroshi Ikenoue, Tanemasa Asano

Proceedings of the 7th International Conference on Photonics, Optics and Laser Technology, 2019

2018

Effect of Subthreshold Slope on Sensitivity of MOS-HEMT Square Law Detector for THz Waves.

Hiromu Kojima, Daishi Kido, Haruichi Kanaya, Hiroyuki Ishii, Tatsuro Maeda, Mutsuo Ogura, Tanemasa Asano

Proceedings of the TENCON 2018, 2018

2015

High-speed via hole filling using electrophoresis of Ag nanoparticles.

Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Room-temperature bonding mechanism of compliant bump with ultrasonic assist.

Keiichiro Iwanabe, Tanemasa Asano

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding.

Akihiro Ikeda, L. J. Qiu, K. Nakahara, Tanemasa Asano

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration.

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

High frequency signal transmission characteristics of cone bump interconnections.

Akihiro Ikeda, Naoya Watanabe, Tanemasa Asano

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

Foreword.

Tanemasa Asano

IEICE Trans. Electron., 2009

2007

Possibility of Terahertz Injection-Locked Oscillation in an InGaP/InGaAs/GaAs Two-Dimensional Plasmon-Resonant Photomixer.

Mitsuhiro Hanabe, Yahya Moubarak Meziani, Taiichi Otsuji, Eiichi Sano, Tanemasa Asano

IEICE Trans. Electron., 2007

2005

Effects of Electric Field on Metal-Induced Lateral Crystallization under Limited Ni-Supply Condition.

Gou Nakagawa, Noritoshi Shibata, Tanemasa Asano

IEICE Trans. Electron., 2005