Takuo Funaya
According to our database1,
Takuo Funaya
authored at least 2 papers
between 2015 and 2019.
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Bibliography
2019
Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression.
Proceedings of the IEEE International Reliability Physics Symposium, 2019
2015
New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D package employing next generation high bandwidth memory (HBM).
Proceedings of the 2015 International 3D Systems Integration Conference, 2015