Takeshi Nokuo
According to our database1,
Takeshi Nokuo
authored at least 2 papers
between 2013 and 2015.
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Bibliography
2015
Scenario for catastrophic failure in interconnect structures under chip package interaction.
Proceedings of the IEEE International Reliability Physics Symposium, 2015
2013
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures.
Microelectron. Reliab., 2013