Takeru Amano
Orcid: 0000-0002-4006-0716
According to our database1,
Takeru Amano
authored at least 9 papers
between 2016 and 2024.
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Bibliography
2024
Thermal Analysis of Reflow Process for PIC-Embedded Package Substrate with 2.3D RDL Interposer for Co-Packaged Optics.
Proceedings of the International 3D Systems Integration Conference, 2024
2023
High-Capacity WDM Transmitter for Co-Packaged Optics by Suppressing SOA-Induced Nonlinearities.
Proceedings of the International Conference on Photonics in Switching and Computing, 2023
Proceedings of the International Conference on Photonics in Switching and Computing, 2023
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023
2021
Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021
2020
Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors.
Proceedings of the European Conference on Optical Communications, 2020
2019
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2016
IEICE Trans. Electron., 2016