Takayuki Ohba

According to our database, Takayuki Ohba authored at least 13 papers between 2011 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy.

Norio Chujo, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2022

Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network.

Kyosuke Kobinata, Tatsuya Funaki, Yoshiaki Satake, Hitoshi Matsuno, Seiji Hidaka, Shunsuke Abe, Hiroyuki Ito, Chih-Cheng Hsiao, Sheng Yi Li, Young-Suk Kim, Takayuki Ohba

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2021

Reliability of Wafer-Level Ultra-Thinning down to 3 µm using 20 nm-Node DRAMs.

Zhwen Chen, Young-Suk Kim, Tadashi Fukuda, Koji Sakui, Takayuki Ohba, Tatsuji Kobayashi, Takashi Obara

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2019

Three-dimensional Integration (3DI) with Bumpless Interconnects for Tera-scale Generation : High Speed, Low Power, and Ultra-small Operating Platform.

Koji Sakui, Takayuki Ohba

Proceedings of the IEEE Custom Integrated Circuits Conference, 2019

High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology.

Koji Sakui, Takayuki Ohba

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias.

Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015

Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation.

Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama

IEICE Electron. Express, 2015

Characterization of stress distribution in ultra-thinned DRAM wafer.

Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie, Takayuki Ohba

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure.

Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Influence of wafer thinning process on backside damage in 3D integration.

Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures.

Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects.

Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Development of ultra-thinning technology for logic and memory heterogeneous stack applications.

Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011