Takasi Simoyama
According to our database1,
Takasi Simoyama
authored at least 11 papers
between 2014 and 2019.
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Timeline
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2019
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Bibliography
2019
70 Gbaud Operation of All-Silicon Mach-Zehnder Modulator based on Forward-Biased PIN Diodes and Passive Equalizer.
Proceedings of the 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC), 2019
2018
Waveguide Butt-Joint Germanium Photodetector with Lateral PIN Structure for 1600nm Wavelengths Receiving.
IEICE Trans. Electron., 2018
Error-Free Loopback of a Compact 25 Gb/s × 4 ch WDM Transceiver Assembly Incorporating Silicon (De)Multiplexers with Automated Phase-Error Correction.
Proceedings of the Optical Fiber Communications Conference and Exposition, 2018
Proceedings of the European Conference on Optical Communication, 2018
2017
Low crosstalk simultaneous 12 ch × 25 Gb/s operation of high-density silicon photonics multichannel receiver.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2017
Ultra-Low-Power (1.59 mW/Gbps), 56-Gbps PAM4 Operation of Si Photonic Transmitter Integrating Segmented PIN Mach-Zehnder Modulator and 28-nm CMOS Driver.
Proceedings of the European Conference on Optical Communication, 2017
Low Crosstalk Simultaneous 16-channel × 25 Gb/s Operation of High Density Silicon Photonics Optical Transceiver.
Proceedings of the European Conference on Optical Communication, 2017
2016
WDM interconnect targeted Si-wire optical demultiplexers for large manufacturing tolerance, low voltage tunability and polarization diversified operability.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2016
2015
A 25 Gbps silicon photonic transmitter and receiver with a bridge structure for CPU interconnects.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2015
Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015
2014
Delayed interferometer based Si-wire WDM demultiplexers fabricated by phase controllable and productive 300-mm wafer-scale ArF-immersion lithography technology.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2014