Takafumi Fukushima

According to our database, Takafumi Fukushima authored at least 71 papers between 2005 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction.

Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2023

Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last.

Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2023

Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding.

Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2023

2022

3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration.

Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

IEICE Electron. Express, 2022

Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip.

Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2022

2021

Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE.

Takafumi Fukushima

Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021

Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System.

Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Proceedings of the IEEE Biomedical Circuits and Systems Conference, BioCAS 2021, 2021

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications.

Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing.

Koji Kiyoyama, Yoshihiko Horio, Takafumi Fukushima, Hiroyuki Hashimoto, Takemori Orima, Mitsumasa Koyanagi

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing.

Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2019

PPG and SpO2 Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System.

Ryosuke Yabuki, Tetsu Tanaka, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama

Proceedings of the 2019 IEEE Biomedical Circuits and Systems Conference, 2019

Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration.

Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI.

Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs.

Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation.

Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Development of 3D-IC Embedded Flexible Hybrid System.

Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration.

Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing.

Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System.

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal.

Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, Hiroyuki Hashimoto, Mitsu Koyanagi

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips.

Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Proceedings of the 2018 IEEE Biomedical Circuits and Systems Conference, 2018

2017

Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current.

Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2017

Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip.

Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Kouji Kiyoyama, Tetsu Tanaka

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2017

2016

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.

Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines, 2016

Studying just-in-time defect prediction using cross-project models.

Yasutaka Kamei, Takafumi Fukushima, Shane McIntosh, Kazuhiro Yamashita, Naoyasu Ubayashi, Ahmed E. Hassan

Empir. Softw. Eng., 2016

Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology.

Mariappan Murugesan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications.

Kang Wook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler.

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

New concept of TSV formation methodology using Directed Self-Assembly (DSA).

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM.

Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.

Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors.

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study.

Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers.

K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University.

K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC.

Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

An empirical study of just-in-time defect prediction using cross-project models.

Takafumi Fukushima, Yasutaka Kamei, Shane McIntosh, Kazuhiro Yamashita, Naoyasu Ubayashi

Proceedings of the 11th Working Conference on Mining Software Repositories, 2014

Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.

Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.

K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.

Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV.

Mariappan Murugesan, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Yuji Sutou, H. Wang, J. Koike

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory.

Kang Wook Lee, Seiya Tanikawa, Mariappan Murugesan, H. Naganuma, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor.

Kouji Kiyoyama, Y. Sato, Hiroyuki Hashimoto, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system.

Hiroyuki Hashimoto, Takafumi Fukushima, Kang Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

3D memory chip stacking by multi-layer self-assembly technology.

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Ho-Young Son, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Development of via-last 3D integration technologies using a new temporary adhesive system.

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration.

Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines, 2011

Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration.

Yuki Ohara, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI.

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

High density Cu-TSVs and reliability issues.

Mariappan Murugesan, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress.

Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Stacked SOI pixel detector using versatile fine pitch μ-bump technology.

Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima, Yasuo Arai, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs.

Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Yuki Ohara, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

A very low area ADC for 3-D stacked CMOS image processing system.

Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, H. Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

High-bandwidth data transmission of new transceiver module through optical interconnection.

Yuka Ito, Shinsuke Terada, Shinya Arai, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Chip-level TSV integration for rapid prototyping of 3D system LSIs.

Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Temporary bonding strength control for self-assembly-based 3D integration.

Takafumi Fukushima, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding.

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.

Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

A block-parallel signal processing system for CMOS image sensor with three-dimensional structure.

Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, Hiroaki Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature.

Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

High-Density Through Silicon Vias for 3-D LSIs.

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proc. IEEE, 2009

Three-dimensional integration technology and integrated systems.

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 14th Asia South Pacific Design Automation Conference, 2009

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Heterogeneous integration technology for MEMS-LSI multi-chip module.

Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

A parallel ADC for high-speed CMOS image processing system with 3D structure.

Kouji Kiyoyama, Yuki Ohara, Kang Wook Lee, Y. Yang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch.

Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.

Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2005

Dynamic Multi-Context Reconfiguration Scheme for Reconfigurable Parallel Image Processing System with Three Dimensional Structure.

Takeaki Sugimura, Yuta Konishi, Yoshihiro Nakatani, Takafumi Fukushima, Hiroyuki Kurino, Mitsumasa Koyanagi

Proceedings of the 18th International Conference on Architecture of Computing Systems, 2005