Tai Chong Chai

According to our database, Tai Chong Chai authored at least 8 papers between 2002 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2012

Modular sensor chip design for package stress evaluation and reliability characterisation.

A. D. Trigg, Tai Chong Chai, Xiaowu Zhang, Xian Tong Chen, Leong Ching Wai

Microelectron. Reliab., 2012

2010

Electromigration performance of Through Silicon Via (TSV) - A modeling approach.

Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu

Microelectron. Reliab., 2010

2008

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP).

Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala

Microelectron. Reliab., 2008

2007

Finite element modeling of capacitive coupling voltage contrast.

Cher Ming Tan, Stanny Yanuar, Tai Chong Chai

Microelectron. Reliab., 2007

2006

Feasibility study of the application of voltage contrast to printed circuit board.

Cher Ming Tan, Zhenghao Gan, Tai Chong Chai

Microelectron. Reliab., 2006

2005

Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist.

Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim

Microelectron. Reliab., 2005

2004

Thermo-mechanical finite element analysis in a multichip build up substrate based package design.

Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath

Microelectron. Reliab., 2004

2002

Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly.

Mohandass Sivakumar, Kripesh Vaidyanathan, Chong Ser Choong, Tai Chong Chai, Loon Aik Lim

Microelectron. Reliab., 2002