Tadatomo Suga

According to our database, Tadatomo Suga authored at least 15 papers between 2002 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of three.

2023

Defect evolution in GaN thin film heterogeneously integrated with CMOS-compatible Si(100) substrate by ion-cutting technology.

Hangning Shi, Ailun Yi, Jiaxin Ding, Xudong Liu, Qingcheng Qin, Juemin Yi, Junjie Hu, Miao Wang, Demin Cai, Jianfeng Wang, Ke Xu, Fengwen Mu, Tadatomo Suga, René Heller, Mao Wang, Shengqiang Zhou, Wenhui Xu, Kai Huang, Tiangui You, Xin Ou

Sci. China Inf. Sci., November, 2023

2019

Growth Behavior of Au Films on SiO₂ Film and Direct Transfer for Smoothing Au Surfaces.

Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi

Int. J. Autom. Technol., 2019

2017

Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method.

Eiji Higurashi, Ken Okumura, Yutaka Kunimune, Tadatomo Suga, Kei Hagiwara

IEICE Trans. Electron., 2017

2016

Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration.

Eiji Higurashi, Michitaka Yamamoto, Takeshi Sato, Tadatomo Suga, Renshi Sawada

IEICE Trans. Electron., 2016

2015

Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer.

Masahisa Fujino, Ikuo Soga, Daiyu Kondo, Yoshikatsu Ishizuki, Taisuke Iwai, Tadatomo Suga

Microelectron. Reliab., 2015

2012

Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials.

Chenxi Wang, Tadatomo Suga

Microelectron. Reliab., 2012

Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging.

Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai

Microelectron. Reliab., 2012

Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding.

Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga

Microelectron. Reliab., 2012

2011

Low temperature bonding for 3D interconnects.

Tadatomo Suga, Ryuichi Kondoh

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

Optical Microsensors Integration Technologies for Biomedical Applications.

Eiji Higurashi, Renshi Sawada, Tadatomo Suga

IEICE Trans. Electron., 2009

Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals.

Eiji Higurashi, Daisuke Chino, Tadatomo Suga

IEICE Trans. Electron., 2009

2007

Low-Temperature Au-to-Au Bonding for LiNbO₃/Si Structure Achieved in Ambient Air.

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Satoshi Shinada, Tetsuya Kawanishi

IEICE Trans. Electron., 2007

2003

Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method.

Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga

Microelectron. Reliab., 2003

Low Contact-Force Fritting Probe Card Using Buckling Microcantilevers.

Kenichi Kataoka, Toshihiro Itoh, Tadatomo Suga

Proceedings of the Proceedings 2003 International Test Conference (ITC 2003), Breaking Test Interface Bottlenecks, 28 September, 2003

2002

Low-Contact-Force Probing on Copper Electrodes.

Kenichi Kataoka, Toshihiro Itoh, Katsuya Okumura, Tadatomo Suga

Proceedings of the Proceedings IEEE International Test Conference 2002, 2002