T. Y. Tee

According to our database, T. Y. Tee authored at least 2 papers between 2009 and 2010.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2010

Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP.

Y. A. Su, Long Bin Tan, T. Y. Tee, Vincent B. C. Tan

Microelectron. Reliab., 2010

2009

Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs.

Z. W. Zhong, T. Y. Tee

Proc. IEEE, 2009