T. Licht

According to our database, T. Licht authored at least 6 papers between 2002 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of six.

2010

A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects.

Bernhard Czerny, Golta Khatibi, Brigitte Weiss, T. Licht

Microelectron. Reliab., 2010

2008

A fast mechanical test technique for life time estimation of micro-joints.

Golta Khatibi, W. Wroczewski, Brigitte Weiss, T. Licht

Microelectron. Reliab., 2008

2006

A new method to characterize the thermomechanical response of multilayered structures in power electronics.

P. Zimprich, T. Licht, B. Weiss

Microelectron. Reliab., 2006

2003

High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC.

Gerard Coquery, Guy Lefranc, T. Licht, Richard Lallemand, Norbert Seliger, H. Berg

Microelectron. Reliab., 2003

2002

Reliable power electronics for automotive applications.

Norbert Seliger, E. Wolfgang, Guy Lefranc, H. Berg, T. Licht

Microelectron. Reliab., 2002

Properties of solders and their fatigue in power modules.

Guy Lefranc, T. Licht, Gerhard Mitic

Microelectron. Reliab., 2002