T. Lepistö

According to our database, T. Lepistö authored at least 1 paper in 2004.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2004

The effect of solder paste composition on the reliability of SnAgCu joints.

S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö

Microelectron. Reliab., 2004