T. Chavez

According to our database1, T. Chavez authored at least 2 papers between 2016 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2023
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2016
Towards a factory-of-things: Channel modeling and deployment assessment in PetroEcuador Esmeraldas oil refinery.
Proceedings of the 8th IEEE Latin-American Conference on Communications, 2016


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