T. C. Hou

According to our database, T. C. Hou authored at least 2 papers between 2017 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Framework for Developing a Knowledge Warehouse Towards a Resilient Semiconductor Assembly and Testing Firm.

Dah-Chuan Gong, T. C. Hou, Phuong Hoang, Brett A. Peters, Ping-Shun Chen

IEEE Access, 2022

2017

On an IC wire bonding machine production-inventory problem with time value of money.

Dah-Chuan Gong, Jia-Lun Kang, Gary C. Lin, T. C. Hou

Int. J. Prod. Res., 2017