Sylvain Joblot

According to our database, Sylvain Joblot authored at least 2 papers between 2013 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer.

Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013