Sylvain Dumas

According to our database, Sylvain Dumas authored at least 4 papers between 2016 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Smart Write Algorithm to Enhance Performances and Reliability of an RRAM Macro.

Bastien Giraud, Sebastien Ricavy, Cyrille Laffond, Ilan Sever, Valentin Gherman, Florent Lepin, Mariam Diallo, Khadija Zenati, Sylvain Dumas, Olivier Guille, Maxim Vershkov, Alessandro Bricalli, Giuseppe Piccolboni, Jean-Philippe Noel, Anass Samir, Gaël Pillonnet, Yvain Thonnart, Gabriel Molas

IEEE J. Solid State Circuits, September, 2024

2023

Benefits of Design Assist Techniques on Performances and Reliability of a RRAM Macro.

Bastien Giraud, Sebastien Ricavy, Yasser Moursy, Cyrille Laffond, Ilan Sever, Valentin Gherman, Manuel Pezzin, Florent Lepin, Mariam Diallo, Khadija Zenati, Sylvain Dumas, Maxim Vershkov, Alessandro Bricalli, Giuseppe Piccolboni, Jean-Philippe Noël, Anass Samir, Gaël Pillonnet, Yvain Thonnart, Gabriel Molas

Proceedings of the IEEE International Memory Workshop, 2023

2016

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy

IEEE Des. Test, 2016

Heat spreading packaging solutions for hybrid bonded 3D-ICs.

Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, Venceslass Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016