Suraj Patil

According to our database, Suraj Patil authored at least 8 papers between 2016 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2024

aMUSEd: An Open MUSE Reproduction.

Suraj Patil, William Berman, Robin Rombach, Patrick von Platen

CoRR, 2024

2023

LCM-LoRA: A Universal Stable-Diffusion Acceleration Module.

Simian Luo, Yiqin Tan, Suraj Patil, Daniel Gu, Patrick von Platen, Apolinário Passos, Longbo Huang, Jian Li, Hang Zhao

CoRR, 2023

Alignment Free Fingerprint Template Security Using Minutia Neighbors.

Suraj Patil, Manik Hendre, Aditya Abhyankar

Proceedings of the IEEE International Carnahan Conference on Security Technology, 2023

Concept Design of a Self Optimized Industry 4.0 Benchmark Plant.

Jayabadhrinath Krushnan, Vishal Patel, Abdallah Dawoud, Chiragbhai Vaghani, Suraj Patil, Frank Schrödel

Proceedings of the European Control Conference, 2023

2022

Directional filter bank-based fingerprint image quality.

Manik Hendre, Suraj Patil, Aditya Abhyankar

Pattern Anal. Appl., 2022

Biometric recognition robust to partial and poor quality fingerprints using distinctive region adaptive SIFT keypoint fusion.

Manik Hendre, Suraj Patil, Aditya Abhyankar

Multim. Tools Appl., 2022

2021

Datasets: A Community Library for Natural Language Processing.

Quentin Lhoest, Albert Villanova del Moral, Yacine Jernite, Abhishek Thakur, Patrick von Platen, Suraj Patil, Julien Chaumond, Mariama Drame, Julien Plu, Lewis Tunstall, Joe Davison, Mario Sasko, Gunjan Chhablani, Bhavitvya Malik, Simon Brandeis, Teven Le Scao, Victor Sanh, Canwen Xu, Nicolas Patry, Angelina McMillan-Major, Philipp Schmid, Sylvain Gugger, Clément Delangue, Théo Matussière, Lysandre Debut, Stas Bekman, Pierric Cistac, Thibault Goehringer, Victor Mustar, François Lagunas, Alexander M. Rush, Thomas Wolf

Proceedings of the 2021 Conference on Empirical Methods in Natural Language Processing: System Demonstrations, 2021

2016

Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration.

Suraj Patil, Asisa Kumar Panigrahi, Satish Bonam, C. Hemanth Kumar, Om Krishan Singh, Shiv Govind Singh

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016