Sung-Hoon Choa

According to our database, Sung-Hoon Choa authored at least 7 papers between 2008 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Wafer-level Packaging Platform for MEMS Sensor Applications.

Taehyun Kim, Junmo Yang, Chungmo Yang, Sung-Hoon Choa, Hee Yeoun Kim

Proceedings of the 21st International SoC Design Conference, 2024

2016

Electromechanical reliability of a flexible metal-grid transparent electrode prepared by electrohydrodynamic (EHD) jet printing.

Sang Min Yang, Yo Seb Lee, Yonghee Jang, Doyoung Byun, Sung-Hoon Choa

Microelectron. Reliab., 2016

2015

Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics.

Kyoungtae Eun, Min-Woo Chon, Tae-Hee Yoo, Yong-Won Song, Sung-Hoon Choa

Microelectron. Reliab., 2015

2014

Mechanical and environmental durability of roll-to-roll printed silver nanoparticle film using a rapid laser annealing process for flexible electronics.

Min Yang, Min-Woo Chon, Joo-Hyun Kim, Seung-Hyun Lee, Jeongdai Jo, Junyeob Yeo, Seung Hwan Ko, Sung-Hoon Choa

Microelectron. Reliab., 2014

2011

Development of Micro-Heaters with Optimized Temperature Compensation Design for Gas Sensors.

Woo-Jin Hwang, Kyu-Sik Shin, Ji-Hyoung Roh, Daesung Lee, Sung-Hoon Choa

Sensors, 2011

Numerical analysis of bonding process-induced deformation for 3D package.

Sung-Hoon Choa, Haeng-Soo Lee, Kyoung-Ho Kim

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2008

Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method.

Jong-Seok Kim, Sang-Woo Lee, Kyu-Dong Jung, Woon-Bae Kim, Sung-Hoon Choa, Byeong-Kwon Ju

Microelectron. Reliab., 2008