Sumant Sood
According to our database1,
Sumant Sood
authored at least 2 papers
in 2010.
Collaborative distances:
Collaborative distances:
Timeline
2010
0
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2
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Bibliography
2010
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.
Proceedings of the IEEE International Conference on 3D System Integration, 2010
Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration.
Proceedings of the IEEE International Conference on 3D System Integration, 2010