Suhana Binti Mohd Said
Orcid: 0000-0001-5258-9070
According to our database1,
Suhana Binti Mohd Said
authored at least 5 papers
between 2012 and 2018.
Collaborative distances:
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Bibliography
2018
Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment.
Microelectron. Reliab., 2018
2015
Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys.
Microelectron. Reliab., 2015
The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy.
Microelectron. Reliab., 2015
2014
Microelectron. Reliab., 2014
2012
Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products.
Microelectron. Reliab., 2012