Sue-Chen Liao

According to our database, Sue-Chen Liao authored at least 1 paper in 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer.

Jui-Chin Chen, John H. Lau, Tzu-Chien Hsu, Chien-Chou Chen, Pei-Jer Tzeng, Po-Chih Chang, Chun-Hsien Chien, Yiu-Hsiang Chang, Shang-Chun Chen, Yu-Chen Hsin, Sue-Chen Liao, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013