Subrat Mishra

Orcid: 0000-0002-1435-3275

According to our database1, Subrat Mishra authored at least 13 papers between 2020 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2024
Thermal Implications in Scaling High-Performance Server 3D Chiplet-Based 2.5D SoC from FinFET to Nanosheet.
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2024

Possible Origins, Identification, and Screening of Silent Data Corruption in Data Centers.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.
IEEE Trans. Very Large Scale Integr. Syst., December, 2023

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Learning-Oriented Reliability Improvement of Computing Systems From Transistor to Application Level.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

Electromigration-aware design technology co-optimization for SRAM in advanced technology nodes.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

2022
Thermal Performance Analysis of Mempool RISC-V Multicore SoC.
IEEE Trans. Very Large Scale Integr. Syst., 2022

Multitimescale Mitigation for Performance Variability Improvement in Time-Critical Systems.
IEEE Trans. Very Large Scale Integr. Syst., 2022

Proactive Run-Time Mitigation for Time-Critical Applications Using Dynamic Scenario Methodology.
Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022

2021
Overhead Reduction with Optimal Margining Using A Reliability Aware Design Paradigm.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020
Fast & Accurate Methodology for Aging Incorporation in Circuits using Adaptive Waveform Splitting (AWS).
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020


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