Stéphanie Escoubas

According to our database, Stéphanie Escoubas authored at least 4 papers between 2013 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

Experimental Study of Force Induced by Probe Length Influence on Electrical Contact Resistance of Pillar Bump-Flat Vertical Probe Interaction during Wafer Electrical Test.

Cedric Hermet, Luc Favre, Stéphanie Escoubas, Salvatore De Siena, Robert Diperi

Proceedings of the IEEE International Conference on Design, 2024

2015

Thermo-mechanical characterization of passive stress sensors in Si interposer.

Benjamin Vianne, Pierre Bar, Vincent Fiori, Sébastien Gallois-Garreignot, Komi-Atchou Ewuame, Pascal Chausse, Stéphanie Escoubas, Nicolas Hotellier, Olivier Thomas

Microelectron. Reliab., 2015

Stress management strategy to limit die curvature during silicon interposer integration.

Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stéphanie Escoubas, Olivier Thomas

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments.

Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stéphanie Escoubas, Nicolas Hotellier, Olivier Thomas

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013